KUALA LUMPUR (March 19): A RM30 billion investment by Intel Corporation in an advanced semiconductor packaging facility in Malaysia is seen as a key driver for the next phase of the country’s chip industry, said the chairman of the Malaysian Investment Development Authority (Mida). Tengku Datuk Seri Zafrul Abdul Aziz said the initiative will go beyond the significance of the cumulative RM49.3 billion investment made by the American multinational technology company in the country over more than five decades. “In 54 years in Malaysia, Intel has invested RM49.3 billion — and continues to grow. The current focus — a RM30 billion investment in an advanced semiconductor packaging facility that is nearly complete and expected to begin operations this year,” he wrote in a post on the X platform on Thursday. Tengku Zafrul stressed that the priority now is to ensure Malaysia fully leverages the investment to expand a high-value industrial ecosystem.

Source: The Edge Markets March 19, 2026 04:38 UTC