US-based research devices a “sand” that can inexpensively provide improved cooling for power-hungry electronic devices. A US-based researcher has devised a new “sand” that can inexpensively provide improved cooling for power-hungry electronic devices. For that reason, Cola plans to identify polymeric materials that could be adsorbed to the silicon dioxide nanoparticles to provide a more stable coating with a reasonable product lifetime. “Using the collective surface electromagnetic effect of the nanoparticles, the thermal conductivity can increase 20-fold, allowing it to dissipate heat,” he added. The researchers used ethylene glycol, a fluid commonly used in vehicle antifreeze, as a heat dissipation material that at the same time did not conduct electricity.

Source: Indian Express July 13, 2016 11:21 UTC