MediaTek plans to double data center spendingBy Lisa Wang / Staff reporterMediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it plans to double investment in data center-related technologies, including advanced packaging and high-speed interconnect technologies, to broaden the new business’ customer and service portfolios. The data center ASIC business would contribute 20 percent to the company’s revenue next year, MediaTek told investors on Wednesday. High-speed SerDes interface technologies are essential for AI, 5G and data center infrastructure to ensure signal integrity. “We will be the first-wave customer of 2-nanometer and A14 advanced process technologies, which will not be limited to data center [chip production],” Chen said. Intel’s EMIB technology is considered a potential alternative to TSMC’s chip-on-wafer-on-substrate technology amid severe supply constraints of the advanced packaging technology.

Source: Taipei Times February 06, 2026 16:13 UTC