TSMC unveils plan for second fab in ArizonaBy Lisa Wang / Staff reporter, with ReutersTaiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it is more than doubling its US investment to US$40 billion as it plans to make 3-nanometer chips in 2026 at a second Arizona fab, adding to the chipmaker’s original plan of building a US$12 billion fab to make 4-nanometer chips in 2024. Taiwan Semiconductor Manufacturing Co’s new wafer manufacturing facility under construction in Phoenix, Arizona, is pictured on Monday. “When complete, TSMC Arizona will be the greenest semiconductor manufacturing facility in the United States producing the most advanced semiconductor process technology in the country, enabling next-generation high-performance and low-power computing products for years to come,” TSMC chairman Mark Liu (劉德音) said in the statement. The chipmaker’s investment is a big win for Biden after supply-chain issues disrupted the US economy early in his presidency. “The occasion for the president’s travel is to mark a significant milestone that TSMC is reaching in bringing the most advanced semiconductor manufacturing back to the US,” US National Economic Council Director Brian Deese said.

Source: Taipei Times December 07, 2022 04:10 UTC