Samsung Electronics announced Tuesday it will ramp up production of its 8-gigabyte high bandwidth memory-2, known as HBM2, to meet growing demand across a wide range of applications including artificial intelligence, high-performance computing, advanced graphics, network systems and enterprise servers. TSV technology enables stacked silicon chips to interconnect through direct contact and can therefore provide high-speed signal processing. The utilization of that many TSVs ensures high performance by enabling data paths to be switched to different TSVs when a delay in data transmission occurs. Samsung holds more than 850 patents for the HBM2 and TSV technologies, which is a result of the company's continuous innovation efforts for the latest DRAM solution, it said. Samsung's 8 GB HBM2 is known to deliver the highest level of HBM2 performance, reliability and energy efficiency in the industry.

Source: The China Post July 18, 2017 09:00 UTC