Intel held a roundtable in which experts discussed the corporate’s adopted strategy in advanced packaging and the capabilities this technology offers its customers. Advanced packaging is a set of technologies that combines and interconnects multiple chips in one package. Intel explained that In addition to cost-savings, advanced packaging allows chip architects to build devices with better performance and more functionality that would otherwise not be possible. Intel® Data Center GPU Max is an example of a product that cannot be built without advanced packaging. The advanced technology also opens the door to many professionals to make use of it in order to come up with better solutions.
